general specifications flangeless terminations 150 watts, 50 model RFP-150-50TCGN resistive element: thick film substrate: beryllium oxide ceramic cover: alumina ceramic lead(s): 99.99% pure silver (.005?thk) outline drawing .042 .070 .250 .125 .375 notes: t olerance is .010, unless otherwise specified. operating temperature is -55? to +150? (see chart). designed to meet or exceed applicable portions of mil-e-5400. all dimensions are in inches. lead length 0.15?minimum. specifications subject to change without notice. electrical specifications resistance value: 50 ohms, 5% frequency range: dc - 3.0 ghz power: 150 watts v .s.w.r.: 1.40:1 flangeless terminations features dc - 3.0 ghz 150 watts beo ceramic ? elded silver leads non-nichrome resistive element low vswr 100% tested ? 1 sales desk usa: v oice: (800) 544-2414 fax: (315) 432-9121 sales desk europe: v oice: (+44) 23 92 232392 fax: (+44) 23 92 251369 ver. 12/5/01
flangeless terminations model RFP-150-50TCGN t ypical performance 2 sales desk usa: v oice: (800) 544-2414 fax: (315) 432-9121 sales desk europe: v oice: (+44) 23 92 232392 fax: (+44) 23 92 251369 power derating suggested mounting procedures board even with lead. min. (2 places) .025 than lead. board lower scale: suggested stress relief methods 1. make sure that the devices are mounted on flat surfaces (.001?under the device) to optimize the heat transfer. 2. position device on mounting surface and solder in place using an indalloy type or an sn63 type solder. 3. solder leads in place using an sn63 type solder with a controlled temperature iron (210?). than lead. board higher scale: not recommended application board lower than lead. % of rated power 150 125 100 75 50 25 100 75 25 50 0 case temperature ? c
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